The external visual inspectioncannotdirectly observe the internal structure of devices, while x-rays have strong penetration ability. After passing through the device, residual x-rays with different intensity distributions can be transformed into images through signal conversion, due to the transmission and reflection characteristics of x-rays by the device is related to densities and thicknesses. Therefore, the x-ray scan is an efficient and fast method for non-destructive analysis of internal defects, which can detect voids, cracks, and other anomalies in the internal structure of devices. Using professional low-energy x-ray testing equipment can perform rapid and real-time non-destructive detection on the internal quality of devices.