Electronic components usually need to be soldered onto PCBs. During the soldering process, electronic components come into contact with high-temperature molten solder. In order to test the reliability and stability of electronic components after soldering, we will use a tin furnace to melt tin, immerse the pins of electronic components in the molten tin, and then inspect the appearance of the pins under the microscope. We will also use the comprehensive tester to check the changes in the electrical parameters of the device, in order to test the electrical resistance and metal melting resistance of electronic components under high-temperature tin immersion conditions.

Application
Integrated Circuits, Transistors, Resistors, Capacitors, Inductors, Transformers, Sensors, Electromechanical Components, Connectors, Power Modules, Signal Modules, etc

Reference Standards
JESD22-B102; IPC J-STD-001; IEC 60068-2-58-2004; GB/T 4937-2018; MIL-STD-883; MIL-STD-202; etc