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TESTING SERVICES

AGING TEST

The life cycle of devices under long-term operation follows the typical “bathtub curve”, which can be divided into infant mortality, useful life and wearout, and can be used to describe the failure characteristics of devices during their usage period. Due to the different characteristic curves of different devices, there are various testing methods available for reliability evaluation of different devices and usage periods. The aging test is one of the important methods used to evaluate reliability. Through a series of accelerated aging tests using temperature and load, the aging tests can simulate the aging process of devices under various factors in real usage conditions, and even strengthen corresponding conditions. It mainly includes temperature aging test, loading aging test, corrosion aging test, irradiation aging test, etc.

Application
Integrated Circuits, Transistors, Resistors, Capacitors, Inductors, Transformers, Sensors, Electromechanical Components, Connectors, PCB, PCBA, Power Modules, Signal Modules, Organic Components, etc

Reference Standards
IEC 60068-2; GB/T 2423; GB/T10592-2008; JESD 47; IPC-A-630; MIL-STD-883; MIL-STD-810; MIL-STD-202; etc